Masterarbeit, 2014
124 Seiten
Chapter 1: Introduction
1.1 Problem Statement
1.2 Aim and Objective
1.3 Scope of Work
1.4 Organisation of Thesis
Chapter 2: Literature Review
2.1 Introduction
2.2 Literature Review
Chapter 3: Modular Multilevel Converter
3.1 Introduction
3.2 Modular Multilevel Converter (MMC).
3.2.1 Features of Modular Multilevel Converter (MMC).
3.2.2 Advantages of Modular Multilevel Converter (MMC).
3.2.3 Working of Modular Multilevel Converter (MMC).
3.3 Sub Module Topologies
3.3.1 Half Bridge Sub Module.
3.3.2 Full Bridge Sub Module.
3.3.3 Clamp Double Sub Module.
Chapter 4: Average and RMS Values Calculation
4.1 Introduction
4.2 Circuit Ananlysis
4.3 Conversion Losses.
4.3.1 Conduction Losses.
4.3.2 Switching Losses.
4.4 Half Bridge Sub Module Calculations
4.4.1 Average Value of the Current.
4.4.2 RMS Value of the Current.
4.5 Full Bridge Sub Module Calculations
4.5.1 Average Value of the Current.
4.5.2 RMS Value of the Current.
4.6 Clamp Double Sub Module Calculations.
4.6.1 Average Value of the Current.
4.6.2 RMS Value of the Current.
Chapter 5: Power Losses Estimation
5.1 Introduction
5.2 Half Bridge Sub Module
5.2.1 Conduction Losses.
5.2.2 Switching Losses.
5.3 Full Bridg Sub Module.
5.3.1 Conduction Losses.
5.3.2 Switching Losses.
5.4 Clamp Double Sub Module.
5.4.1 Conduction Losses.
5.4.2 Switching Losses.
Chapter 6: Solution based on MATLAB Simulation: Case Study.
6.1 Introduction
6.2 Half Bridge Sub Module
6.3 Full Bridge Sub Module.
6.4 Clamp Double Sub Module.
6.5 Summary
Chapter 7: Conclusion.
7.1 Conclusion of Research Work.
7.2 Future Directions.
The primary aim of this research is to develop an analytical method for calculating conversion losses and efficiency of various sub-module topologies used in Modular Multilevel Converter (MMC) based HVDC systems, providing engineers with a reliable tool for system design and optimization.
3.3.1 Half Bridge Sub Module
Structure of half bridge sub module (chopper cell) is shown in Figure 3-2. Half bridge sub module consists of two IGBTs; T1 and T2, two freewheeling diodes; D1 and D2 and a capacitor. As mentioned early, a sub module is a two terminal device. The voltage across the sub module is VAB, which is equal to the voltage across the capacitor, Vcap. The switching states and the sub module voltages are shown in Table I. For positive arm current (bridge current), ib, either the diode D1 or IGBT T2 is conducting. For the conduction of diode, D1 the capacitor will charge, giving the sub module voltage equal to capacitors voltage. While for IGBT, T2 the sub module is by passed, resulting in zero sub module voltage.
For negative arm current, either diode D2 or IGBT T1 is conducting. For IGBT T1 conduction, the capacitor is discharged, resulting in the sub module voltage equal to the capacitor’s voltage. While for the conduction of Diode D2, the voltage across the sub module is equal to zero, by-passing the sub module.
Chapter 1: Introduction: Provides an overview of HVDC systems, identifies the design challenges in MMC technology, and outlines the thesis objectives and structure.
Chapter 2: Literature Review: Surveys existing research on MMC loss estimation techniques from 2003 onwards, establishing the need for the proposed analytical method.
Chapter 3: Modular Multilevel Converter: Details the construction, working principles, and specific features of MMC, comparing various sub-module topologies like half-bridge and full-bridge.
Chapter 4: Average and RMS Values Calculation: Derives the mathematical relationships for average and RMS currents flowing through switching devices under different operating conditions.
Chapter 5: Power Losses Estimation: Calculates conversion losses for each sub-module topology using the derived current equations from the previous chapter.
Chapter 6: Solution based on MATLAB Simulation: Case Study: Presents simulation results, including efficiency curves and loss analysis, to validate the derived analytical models.
Chapter 7: Conclusion: Summarizes the key findings of the research regarding sub-module efficiency and provides recommendations for future investigative work.
Modular Multilevel Converter, MMC, HVDC, Power Electronics, Conduction Losses, Switching Losses, Half Bridge, Full Bridge, Clamp Double Sub Module, MATLAB Simulation, Efficiency, IGBT, Current Analysis, RMS Value, Transmission System.
The research focuses on accurately calculating and comparing conversion losses and efficiency for different sub-module topologies within MMC-based HVDC transmission systems.
The thesis examines the half bridge, full bridge, and clamp double sub-module topologies.
The goal is to provide design engineers with a robust analytical method and a MATLAB-based tool to estimate semiconductor power losses during the design phase of MMC systems.
The study utilizes an analytical approach based on the calculation of average and root mean square (RMS) values of currents flowing through semiconductor devices to derive loss and efficiency formulas.
The main body covers the theoretical background of MMC, the mathematical derivation of current-based loss models, and the numerical verification of these models through MATLAB simulations.
Key terms include Modular Multilevel Converter (MMC), HVDC, semiconductor power losses, efficiency estimation, and sub-module topologies.
MMC is noted for its low switching frequency, low converter losses, flexible control, and easier scalability, making it ideal for modern HVDC applications.
The research acknowledges that junction temperature significantly impacts semiconductor device performance and incorporates it into loss considerations using temperature coefficients.
The analysis indicates that the clamp double sub-module has higher total power losses compared to the full bridge due to the inclusion of additional transistors and diodes.
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